JPH024783Y2 - - Google Patents
Info
- Publication number
- JPH024783Y2 JPH024783Y2 JP5265085U JP5265085U JPH024783Y2 JP H024783 Y2 JPH024783 Y2 JP H024783Y2 JP 5265085 U JP5265085 U JP 5265085U JP 5265085 U JP5265085 U JP 5265085U JP H024783 Y2 JPH024783 Y2 JP H024783Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- cleaning
- soldering
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 42
- 238000004140 cleaning Methods 0.000 claims description 40
- 239000007788 liquid Substances 0.000 claims description 17
- 210000000078 claw Anatomy 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 230000004907 flux Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265085U JPH024783Y2 (en]) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5265085U JPH024783Y2 (en]) | 1985-04-09 | 1985-04-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61172649U JPS61172649U (en]) | 1986-10-27 |
| JPH024783Y2 true JPH024783Y2 (en]) | 1990-02-05 |
Family
ID=30572794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5265085U Expired JPH024783Y2 (en]) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024783Y2 (en]) |
-
1985
- 1985-04-09 JP JP5265085U patent/JPH024783Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61172649U (en]) | 1986-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070108044A1 (en) | Plating tank | |
| JPS5831883Y2 (ja) | 透孔を有する薄板の無電解メツキ装置 | |
| JPH0469506B2 (en]) | ||
| CN115623691B (zh) | 一种印制电路板送料装置及蚀刻装置 | |
| JPH024783Y2 (en]) | ||
| DE69815221T2 (de) | Waagrechtes Lötungsystem mit Öldecke | |
| CN216234995U (zh) | 一种超薄板水平线移载装置 | |
| JP3075610B2 (ja) | ハンダコーテイング装置 | |
| JPS6274089A (ja) | プリント基板製造装置 | |
| JPH064609Y2 (ja) | 実装基板の端面洗浄装置 | |
| US2838651A (en) | Apparatus for making and welding can bodies | |
| CN211680422U (zh) | 一种全自动金线焊线机 | |
| KR0148950B1 (ko) | 칩부품 자동장착기의 인쇄회로기판 반전장치 | |
| JPS643577Y2 (en]) | ||
| JPH032374Y2 (en]) | ||
| JP2715400B2 (ja) | フラックス塗布装置 | |
| JPH0329005Y2 (en]) | ||
| JP3555375B2 (ja) | 電子部品実装ラインにおける基板の搬送装置およびその無端ベルトの交換方法 | |
| US1338716A (en) | Soldering-machine | |
| JPH059190B2 (en]) | ||
| JP2573149Y2 (ja) | 自動はんだ付け装置 | |
| JPS6331822Y2 (en]) | ||
| JPH025505B2 (en]) | ||
| US3614941A (en) | Glue pot | |
| JPS6336645Y2 (en]) |